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TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

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TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

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Brand Name : Ziitek

Model Number : TIC™800A-AL series

Certification : UL & RoHS

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*13*12cm cartons

Products name : TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

Keywords : Thermal Phase Changing Material

Density : 2.5g/cc

Thickness : ±0.005"(0.126mm)

Applicatoin : Netbook and desktop PCs,Memory Modules

Thermal conductivity : 2.5W/mK

Feature : Nuturally Tacky At Room Temperature,no Adhesive Required

Phase change softening temperature : 50℃~60℃

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TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

TIC™800A-AL series is low melting point thermal interface material. At 50℃,TIC™800A-AL series begins tosoften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuitpackage surface,thereby reducing thermal resistance.

TIC™800A-Al series is a flexible solid at roomtemperature and freestanding without reinforcing components that reduce thermal performance.


TIC™800A-AL Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500cycles, from -40℃ to 125C.The material softens and does not fully change state resulting in minimalmigration (pump out)at operating temperatures.

TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

Features


> 0.021℃-in²/W thermal resisitance

> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required


Applications


> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TICTM800A-AL Series
Product Name TICTM805A-AL TICTM808A-AL TICTM810A-AL TICTM820A-AL Test Method
Color Gray / Silve Gray / Silver Gray / Silver Gray / Silver Visual
Thickness 0.005" 0.008" 0.010" 0.020"  
(0.126mm) (0.203mm) (0.254mm) (0.508mm)
Thickness Tolerance ±0.0008'' ±0.0008'' ±0.0012'' ±0.0020''  
(±0.019mm) (±0.019mm) (±0.030mm) (±0.050mm)
Density 2.5g/cc Helium Pycnometer
Temperature range -25℃~125℃  
Phase Change Softening Temperature 50℃~60℃  
Thermal Conductivity 2.5 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.063℃-in²/W 0.08℃-in²/W 0.097℃-in²/W 0.157℃-in²/W ASTM D5470 (modified)
0.40℃-cm²/W 0.52℃-cm²/W 0.63℃-cm²/W 1.13℃-cm²/W

Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm),0.020"(0.508mm)
Consult the factory alternate thickness.


Standard Sizes:
10" x 16"(254mm x 406mm)

TIC™800A-Al series are supplied with a white release paper and a bottom liner.

TIC™800A-AL series is available in kiss cut an extended pull tab liner or individual die cut shapes.


Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for
TIC™800A-AL series products.

Reinforcement:
No reinforcement is necessary.

TIC800A-AL Low Melting Point Thermal Phase Changing Material For Memory Modules

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

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