Zpaster100-15-02F mỏng hơn, không có silicon
Z-Paster100-15-02F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.
It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Silicone-free
> ROSH compliance
> Good thermal conductive:1.5 W/mK
> Soft and Compressible for low stress applications
> Available in varies thickness
Application
> Cooling components to the chassis of frame
> Car Battery & Power Supply
> Charging Pile
> Silicone-sensitive applications
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of Z-Paster100-15-02F Series |
| Color | Gray/White | Visual | Dielectric Breakdown Voltage (T= 1mm above) | >5000 VAC | ASTM D149 |
| Construction | Silicone-free The metal oxide fills | ******* | Dielectric Constant | 5.5 MHz | ASTM D150 |
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 | Volume Resistivity | 6.3X1013 Ohm-meter | ASTM D257 |
| Hardness | 55 Shore 00 | ASTM 2240 | Continuous Use Temp | –20 To 125℃ | ******** |
| Specific Gravity | 2.55 g/cc | ASTM D297 | Outgassing (TML) | 0.30% | ASTM E595 |
| Thickness range | 0.010"-0.200" (0.25mm-5.0mm) | ASTM D374 | Flame Rating | 94 V0 | equivalent to |
Standard Thicknesses
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Options
Proprietary NS1 option available to eliminate tack from one side to aid in handling.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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Zpaster100-15-02F Non-Silicone Thermal Conductive filler Pad Images
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